The RF-250 is a hot plate type reflow soldering machine with large heating capacity. Using far-infrared and hot-air heating, it can reflow solder difficult boards requiring large heating capacity such as ceramic and enamel boards, as well as steel, aluminum, and other metal circuit boards. The carrier-bar (or Teflon sheet carrier) presses the circuit board to be soldered directly on top of the hot plate and slides it along. As the board is directly heated by the hot plate, even boards requiring high heat capacity can be efficiently reflow soldered in a short time and with high temperature precision.
|Height of an inlet||40mm|
(Only the 4th zone is up IR heater used together.)
|Temperature control||P.I.D. temperature controller.|
|Conveyor||Method||Carrier bar (metal fitting to push back of board) system.
or Teflon sheet carrier system.
|Speed||50 to 1000mm/min (Digital)|
|Direction||R → L or L → R (at user's request)|
|Cooling||Forced cooling by a fan on the outlet side.|
|Power supply||Single phase 220V about 7.5kW|
|Safety devices||Current leak/Over-current breaker
Emergency stop switch
Alarm output (over/under temperature)