Hot Plate

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These are easy-to-use high-precision hot plates developed for pre-heated or reflow soldering of SMT PC
boards, and can be used in QFP, BGA repair work etc. 


  • 2-stage heating, such as preheating and reflow heating, is possible due to the two independent hot plates.
  • Equipped with a work plate.


  • Hot Plates :100×100×15mm (2plates)
  • Operable Temperature Range :0 to 400°C
  • Temperature Precision :±1%
  • Sensor :Thermoelectric couple K(CA)
  • Temperature control :PID
  • Heater :Cartridge heater (300W/120V×2)/plate
  • Start-up time (20°C→200°C) 8 minutes
  • Applicable circuit boards :Max 100×100mm
  • Work plate :180×180mm
  • Power Supply :AC100V/120V/220V/240V and 850W/100V, 1.2kW/120V
  • External dimensions :(W)430×(D)180×(H)113mm
  • Weight :5kg


  • Pre-heat and reflow soldering of Hybrid IC boards and mini-SMT boards.
  • Thermosetting of adhesives.
  • High-precision temperature testing.

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